Multilayer Varistor
This specification is applicable to Chip Metal Oxide Varistor in multilayer technology.
The customer designed part number drawing take precedence over this specification.


1. Insulator over coat keeps excellent low and stable leakage current.
2. Solder layer plating for terminal electrode keep excellent assembly Solderability even after long term storage.
3. Low clamping Voltage.
4. Compact size for EIA 0603/0402.
5. Quick response time (<1ns.)
6. High transient current capability.
7. Meet IEC 61000-4-2, 61000-4-4 and 61000-4-5 standard.
8. RoHS Compliance.


VPORT Series for EMI&ESD(PDF: 493KB, 2006.12.26)
MLVG Series for ESD only(PDF: 505KB, 2006.12.26)
MLVS Series(PDF: 507KB, 2006.12.26)